The process flow：

Feed port automatic feeding - load plate reading - plasma cleaning - discharge port automatic feeding/caching.

Application field：

Suitable for all kinds of camera module, wafer precision cleaning.

Characteristics of the equipment：

• The equipment is suitable for production through connection with the customer's upper and lower work stations and automatic loading and unloading of the equipment for separate production;

• The equipment frame and shell are made of double mirror SUS304 stainless steel sheet metal to meet the requirements of grade 100 workshop;

• The operating height of the equipment is 950mm, and the adjusting height of the foot cup is 950±50mm;

• The cleaning machine is composed of a conveyor track, a reading component (reserved for MES system docking), a plasma cleaning component, and a cache horizontal group;

Technical parameters：